Effect of temperature on removal of copper from electroplating industrial sludge via biosolubilization: kinetics and thermodynamics studies
International Journal of Development Research
Effect of temperature on removal of copper from electroplating industrial sludge via biosolubilization: kinetics and thermodynamics studies
Received 10th May, 2017; Received in revised form 15th June, 2017; Accepted 22nd July, 2017; Published online 30th August, 2017
Copyright ©2017, Chandolu Prasanthi and Jayesh Gangrade. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
The industrial sludge with heavy metal poses a severe threat to the environment and human health when it is disposed to a landfill site without proper treatment. In this work, the removal of Cu from electroplating industrial sludge by biosolubilization was studies using adapted Acidithiobacillus ferrooxidans as the bacterial agent with due importance for investigating the effect of temperature. The experiments were carried out in 250 mL Erlenmeyer flasks with 5% (w/v) sludge and at the different temperatures between 27 and 39C. Experimental results showed that the temperature had great impact on biosolubilization, and the ideal temperature was found to be 36C. The pseudo-first-order kinetic model was used to determine the rate-constant values of Cu solubilization at different temperatures. Using the shrinking core model analysis, the rate-controlling step was identified. In addition, the activation energy, Gibbs free energy, and change in enthalpy and entropy were calculated for the biosolubilization process.