Heat Transfer In Electronic Devices
International Journal of Development Research
Heat Transfer In Electronic Devices
Received 01st December, 2020 Received in revised form 09th December, 2020 Accepted 03rd January, 2021 Published online 28th February, 2021
Copyright © 2021, Prof. PhD Daniela Gotseva and Assist. Prof. PhD Yordan L. Milev. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
Modern micro equipment is characterized by a reduction in the mass and dimensions of their elements which requires increased reliability. Тhis requires a systematic approach to objective data on their thermal regimes, in order to adopt more accurate design and technological solutions for operation with temperature distribution using the finite difference method.
